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| Welcome to Nepes Corporation |
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About Us
Nepes offers flip chip solutions ranging from wafer bumping to advanced packaging and testing for IC manufactures, module electronics and end-product makers.
As a total solution provider for the back-end processing of FPD driver IC NEPES provides a proven gold bumping technology for LCD, PDP and OLED applications, where higher performance, high density and aggressive form factor are critical. NEPES can provide various turn-key solutions, ranging from bumping, probe test to final packaging of ...
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